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I-BIT CO LTD
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I-BIT CO LTD

I-BIT CO LTD

Kanagawa, Japan

Manufacturer

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Automatic X-Ray Equipment
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Model No.:
SIX-2000
Description
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Description
Featured is a high speed inspection wafer bump inspection equipment. This equipment is the automatic X-ray equipment that provides void detection of solder bump. The precise and professional design guarantees reliable performance.
  • This equipment is the automatic X-ray equipment which provides void detection of solder bump. 
  • It penetrates by using void (bubble) in the wafer and using X-rays, and the automatic judgment inspection.
  • Quality of void more than a standard value.
  • Done from the transfer imaging for the diameter of void (area).

I-BIT CO LTD

I-BIT CO LTD

Kanagawa, Japan

Manufacturer

Average Response Time

N/A

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